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Coil Winding and Automation Systems

GS-Automation S.A.

The Phenix

The Phenix is a turntable bonding system, using thermo compression ( pending patent ) to bond chips or modules to the lead wires of a coil. 

The Phenix is mainly used together with our Biphedre in the production of RFID components

 

 TECHNICAL SPECIFICATIONS

Two position turntable , using nests to manually load coils and chips/modules at the operator side.

Bonder Table

 

  Programmable soldering parameters :
        -
Bonding pressure
        -
Temperature
        -
Time

Scrap wire removal by suction.

Fast tool change
            - no adjusting
            - pinned pose.

PRODUCTION TYPE

Coils : Tags and smart-card coils to bond to:

Chips (H and P chips), Micro Modules (M and N modules).

OPTION

Video control (camera) of the bonding quality.

Chips/modules loading systems from reel.

Ask our specialists to evaluate your application and be sure 

we will find the most appropriate solution to your problem

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